Deutsche Version

Plasma Fine Cleaning Utilizaion

Plasma microcleaning is used on electronic components to remove ultrafine traces of hydrocarbons and oxides for improved soldering results.

Laser components for the microchip industry are plasma-cleaned to a degree of purity that is not achievable by any other cleaning method.

Parts to be joined by brazing in a vacuum furnace can be provided with a very pure, oxide-free surface by plasma microcleaning. The resulting high-grade surface gives rise to optimum joint qualities.

Machine Parts
Blade carriers	=>	microcleaning before tip is brazed into position
Laser tubes	=>	pre-assembly microcleaning

Electronic components
Circuit boards	=>	microcleaning before soldering
Processors	=>	microcleaning before soldering

Medical Equipment
Implants	=>	removal of trace hydrocarbons

Particularities
Environmental compatibility ?	=>	very good, no environmentally harmful substances are used
Residue ?	=>	none (carbohydrates are burnt into carbon dioxide)
Component shapes ?	=>	all, even highly complex and detailed geometries
Treatment duration?	=>	a few minutes
Materials ?	=>	all solid materials